Reducing Complexity In Data Center Cooling Temperature Measurements

As computing workloads grow increasingly dense, hyperscale data centers are transitioning from air-based to liquid cooling solutions. Driven by advancements in highperformance computing (HPC) and AI workloads, liquid cooling offers excellent thermal efficiency for modern hardware, such as GPUs and high-density CPUs. Air cooling struggles with thermal management in densely packed environments, leading to hotspots and reduced efficiency.

The shift to liquid cooling is being driven by these limitations of air cooling, which may no longer be able to keep up with the thermal demands of cutting-edge technology. Liquid cooling offers superior heat transfer capabilities, addressing these limitations by efficiently dissipating heat from high-performance components. This trend has resulted in a growing demand for solutions ensuring uptime and reliability in these highperformance environments.

This white paper explores the challenges of reducing complexity in data center cooling temperature measurements and how modern instrumentation, like Endress+Hauser’s iTHERM SurfaceLine TM611, can enhance related processes.