News | August 4, 2011

Non-Destructive Package Testing: Driving Sustainable Operations

Source: PTI - Packaging Technologies & Inspection

Oliver Stauffer of PTI Inspection Systems will give a presentation on "The Importance of Non-Destructive Testing" during the Pack Expo Conference Sessions at the upcoming Pack Expo in Las Vegas, Nevada, September 26 – 28, 2011.

Stauffer, international business development manager for PTI, will discuss package inspection technologies and non-destructive testing solutions on Monday, September 26, 2011 at 11:30 am – 12:30 pm as part of the Conference Sessions Program, sponsored by the Institute of Packaging Professionals (IOPP). He will address the advantages and benefits of implementing a non-destructive inspection method, and will focus specifically on the issues of cost, test method (subjectivity vs. hard data), sampling, and market trends.

"There is an increased awareness about the importance of package and seal integrity across all industries, particularly in pharmaceutical, food and medical device," Oliver commented. "The packaging industry as a whole has recognized the demand for better, faster inspection methods that over time cost less because less waste is produced. Destructive test methods without a data stream are being replaced by systems that conform to a uniform standard, such as the ASTM. There is a growing concern that some of the traditional test methods that have had longevity in the packaging industry, many of which are destructive, are no longer reliable and produce a substantial amount of waste." Oliver added, "Technologies that yield repeatable, quantifiable statistical test data are necessary to meet the needs of the packaging industry today, and reliable testing that is beyond subjective results is needed to protect the manufactured product."

Michelle Wolf, marketing communications manager for PTI, stated "Attendees will learn about the challenges, opportunities and latest technology solutions that exist for cost savings and increased efficiency. This is an excellent opportunity for quality assurance professionals to hear a presentation about the importance of non-destructive testing and how these technologies can assist companies to support sustainable business practices."

Click the link below for complete information about the Conference Sessions during Pack Expo.

Register before September 7 to receive discounted registration rates.
http://www.packexpo.com/pelv2011/public/Content.aspx?ID=831

PTI will be exhibiting during the Pack Expo, September 26 -28 in Booth C-2127. Use link below for free registration.
http://registration2.experient-inc.com/showPAC111/Default.aspx?source=EXHGP&GP=29Z26

About Oliver Stauffer
Oliver Stauffer received his Bachelors of Science degree from the University of Michigan and recently completed his MBA at Georgetown University – The McDonough School of Business. He worked for several years in analytical and R & D laboratories. His expertise and focus has primarily been new technologies and test method development specific to package testing. Stauffer joined PTI in 2005 as a member of the research and development team working on non-destructive testing of blister packaging. In 2006, he joined the sales team as sales/applications engineer for PTI Inspection Systems. He currently holds the position of International Business Development Manager for PTI, focusing on global quality solutions for package inspection that are robust, faster, cleaner, cheaper to maintain, and that reduce manufacturing waste.

About PTI Inspection Systems
PTI Inspection Systems is the leading manufacturer of non-destructive package inspection technologies for the pharmaceutical, medical device, food and container industries. We offer inspection systems for package integrity testing, seal integrity, leak testing and container closure integrity testing (CCIT). Our technologies exclude subjectivity from package testing, and use test methods that conform to ASTM standards. PTI Inspection systems provide repeatable, reliable results and can be used at any point in the manufacturing process as they are non-destructive, non-invasive and require no sample preparation.

SOURCE: PTI - Packaging Technologies & Inspection